Interconnect including a pliable surface and use thereof
US7560817B2 · kind B2 · utility
3Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Jul 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.