Package structure of MEMS microphone
US7560857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Jun 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.