Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system
US7561433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Nov 1, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, each semiconductor chip has a heat sink spring-loaded against the semiconductor chip. Posts coupled to one board engage posts located on the other board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.