Monitoring of cleaning process
US7563329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2005 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Nov 15, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N31/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for monitoring a cleaning process for a medical instrument, includes the steps of placing the instrument in a cleaning chamber; placing a soil standard in the cleaning chamber; cleaning the instrument and the soil standard with a cleaning solution; and detecting whether soil remains on said soil standard. The soil standard includes two substantially parallel substrates separated with two substantially equal thickness spacers, wherein a gap is formed between the two substrates with soil in the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.