CMP composition with a polymer additive for polishing noble metals
US7563383B2 · kind B2 · utility
11Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2004 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Dec 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/694
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof, (b) an oxidizing agent, (c) an ethylene-oxide containing polymer, and (d) a liquid carrier, and abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.