Patent · US Expired

Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself

US7564080B2 · kind B2 · utility

2Cited by

10References

25Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Christian Ferstl · Neutraubling, DE
Stefan Grötsch · Regensburg, DE
Markus Zeiler · Nittendorf, DE

Key dates

Filing date	May 26, 2004
Grant date	Jul 21, 2009
Priority date	—
Expiry date	Jun 24, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/02234
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method for producing a laser diode component having an electrically insulating housing basic body and electrical connecting conductors, which are led out from the housing basic body and are accessible from outside the housing basic body. The housing basic body is produced from a material which is transmissive to a laser radiation emitted by the laser diode component. The housing basic body includes a chip mounting region. A beam axis of the laser diode component runs through the housing basic body. A housing that can be produced in this way and laser diode component having a housing of this type are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.