Temperature characteristic inspection device
US7564253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2006 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Jan 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Optoelectronic properties of optical communication LEDs, LDs and PDs should be examined in a wide range of temperatures between −40° C. and +85° C. Low temperature photocharacteristics of as-chip devices are tested by preparing an inspection stage cooled at a low temperature encapsulated in a shield casing with a front opening, conveying a chip of LD, LED or PD by a collet via the opening, placing the chip on the cold stage, blowing the stage and chip with cool dry air for preventing the chip from wetting, touching the chip by a probe, applying a current/voltage to the chip, examining emission/detection of the chip and taking the chip off via the opening by the collet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.