High directivity ultra-compact coupler
US7564325B2 · kind B2 · utility
2Cited by
8References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/185
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A coupler includes a substrate and a stack of first and second dielectric layers extending over a top surface of the substrate. The first dielectric layer comprises different dielectric material than the second dielectric layer. Two conductive lines extend over the stack of first and second dielectric layers, and are formed in the same plane parallel to a surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.