Thermal expansion compensation assemblies
US7564327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2006 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Nov 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/30
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.