Micromechanical device having integrated heating
US7564338B2 · kind B2 · utility
2Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2005 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Aug 13, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/115
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical device having a micromechanical component and a heating element and a method for controlling and/or regulating the heating element. In this context, the heating element is used to bring the micromechanical component, which preferably has electrical components, and/or a passivator surrounding the micromechanical component to a specifiable temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.