Cooling subsystem with easily adjustable mounting assembly
US7564683B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2007 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Sep 10, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/184
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting a motherboard includes a mounting boss and a boss backing. The mounting boss is alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard. The boss backing is adapted to connect with the mounting boss in the first orientation through the motherboard having the first hole spacing, and adapted to connect with the mounting boss in the second orientation through the motherboard having the second hole spacing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.