Wafer surface observation apparatus
US7565002B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2001 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | May 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dicing apparatus for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.