High frequency module
US7565116B2 · kind B2 · utility
10Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2005 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Mar 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09972
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.