Print head with thin membrane
US7566118B2 · kind B2 · utility
15Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2004 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Mar 28, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.