Flexible enrobed molding device for manufacturing a sunken groove in a tire tread
US7566213B2 · kind B2 · utility
1Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2007 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Oct 30, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D2030/0613
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold and molding device for forming a sunken groove in a tire is provided. The molding device includes a thin flexible wire having one or more molded elastomer elements thereon. The flexible wire is preferably hyperelastic and the molded elastomer is preferably silicone rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.