Insulated conductive particles and anisotropic conductive adhesive film using the same
US7566494B2 · kind B2 · utility
6Cited by
0References
37Claims
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Key dates
| Filing date | Jan 5, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Jul 21, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided.In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.