Wiring board and semiconductor package using the same
US7566834B2 · kind B2 · utility
10Cited by
6References
11Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 16, 2008 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Jun 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.