Systems and methods for a tilted optical receiver assembly
US7566866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2007 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Nov 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.