Multi-stacked package and method of manufacturing the same
US7566961B2 · kind B2 · utility
11Cited by
5References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Nov 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-stacked package includes a first package, a second package and a combining member. The second package supports the first package, and is electrically connected to the first package and has at least one joint hole. The combining member extends from the first package to below the second package to pass through the joint hole so that the combining member is partially exposed to improve the coherence between the first package and the second package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.