Motor
US7567000B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Nov 28, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04D29/5806
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A motor includes a heat dissipating structure. The motor may be used for a fan and includes on an upper surface of a circuit board a heat dissipating layer. The heat dissipating layer has a high thermal conductivity. The fan also includes a coil provided on the teeth of a stator core. The heat dissipating layer and the coil axially face each other, and thermal conductive members are arranged therebetween. An outer dimension of the circuit board is greater than that of an impeller cup so that a radially outward portion of the circuit board protrudes radially outwardly from the impeller cup. The heat generated by the coil is transferred to the heat dissipating layer via the thermal conductive members. Therefore, the heat is dissipated from a wide area, which efficiently dissipates heat from the fan. In addition, since the circuit board and the heat dissipating layer protrude radially into an air-flow generated by an impeller, the heat transferred to the heat dissipating layer is actively dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.