Two-part microprobes for contacting electronic components and methods for making such probes
US7567089B2 · kind B2 · utility
11Cited by
50References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Dec 7, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06733
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.