Semiconductor device with a cooling element
US7567597B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2003 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Jun 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02484
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.