Method of determining stress
US7568396B2 · kind B2 · utility
2Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2006 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Oct 30, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromachined strain gauge comprising a plastically deformable piezoresistive microstructure formed on a surface of a substrate so that deformation of the substrate plastically deforms the microstructure to thereby change the resistance of the microstructure. The stress in the substrate can be determined from the change in the resistance of the microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.