Electrically conductive paste and multilayer ceramic substrate
US7569162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2004 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Nov 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.