Solder precoating method
US7569164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2007 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Jan 29, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1486
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.