Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
US7569428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2006 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Jan 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for manufacturing a method for manufacturing a semiconductor device which comprises a substrate, a semiconductor chip and a plurality of terminals. The method comprises preparing the substrate comprising an insulator which is formed with a plurality of signal lines, a plurality of power lines related to the plurality of signal lines and a plurality of ground lines related to the plurality of signal lines on the insulator in accordance with a predetermined layout. Each of the plurality of line groups comprises one of the power lines, one of the ground lines and one of the signal lines arranged between the one of the power lines and the one of the ground lines. Each of the plurality of line groups shares any one of the power line and the ground line with a neighboring line group of the plurality of line groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.