Electrochemical etching
US7569490B2 · kind B2 · utility
73Cited by
18References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2005 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Jul 7, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods to etch a workpiece are described. In one embodiment, a workpiece is disposed within an etchant solution having a composition comprising a dilute acid and a non-ionic surfactant. An electric field is generated within the etchant solution to cause an anisotropic etch pattern to form on a surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.