Patent · US Expired

Apparatus and method for deposition of thin films

US7569494B2 · kind B2 · utility

1Cited by
11References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 19, 2002
Grant dateAug 4, 2009
Priority date
Expiry dateNov 19, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S505/826
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An apparatus for forming a multicomponent thin film, such as a superconducting thin film, on a substrate includes a holder for holding at least one substrate and a deposition/reaction vessel. The deposition/reaction vessel has at least three zones, each zone being separated from adjacent zones by a wall. The zones include at least two deposition zones, where each deposition zone is configured and arranged to deposit a deposition material on the at least one substrate, and at least one reaction zone for reacting the deposition material with a reactant. The apparatus is configured and arranged to rotate the at least one substrate sequentially through the plurality of zones to form a thin film on the substrate. In some embodiments of the apparatus, the deposition/reaction vessel includes a same number of deposition zones and reaction zones which may be alternating deposition and reaction zones.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.