Radiation-curable resin composition and cured product thereof
US7569619B2 · kind B2 · utility
8Cited by
9References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2005 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | May 6, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2007/24316
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation-curable resin composition comprising an inorganic component containing a silica particle composed of a hydrolyzate of an oligomer of an alkoxysilane and a monomer and/or an oligomer thereof, wherein viscosity at 25° C. is from 1,000 to 10,000 centipoises.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.