Curable bonded assemblies capable of being dissociated

US7569624B2 · kind B2 · utility

Assignees

• Degussa AG · DE
• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Jana Kolbe · Bremen, DE
• Thomas Kowalik · Bremen, DE
• Matthias Popp · Roseville, US
• Monika Sebald · Bremen, DE
• Oliver Schorsch · Bremen, DE
• Stefan Heberer · Gelnhausen, DE
• Markus Pridoehl · Großkrotzenburg, DE
• Guido Zimmermann · Hanau, DE
• Andreas Hartwig · Ritterhude, DE
• Erwin Born · Bremen, DE

Key dates

• Filing date: Nov 12, 2002
• Grant date: Aug 4, 2009
• Expiry date: Jun 23, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1158
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention concerns an adhesive composition for producing thermoset products, capable of being heated by means of an electric field, a magnetic field, an electromagnetic field or an alternating electromagnetic field, and containing filler particles which are metallic, ferromagnetic, ferrimagnetic, superparamagnetic or paramagnetic. Said adhesive composition can be hardened under the action of heat to form a high-resistance stable adhesive assembly, said resulting adhesive assemblies capable of being likewise dissociated under the action of heat.