Sealant composition having reduced permeability to gas
US7569653B2 · kind B2 · utility
61Cited by
64References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 1, 2006 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Mar 1, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin, the cured composition exhibiting low permeability to gas(es).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.