3D MMIC balun and methods of making the same
US7570129B2 · kind B2 · utility
16Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2005 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Mar 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.