Variable spring rate thermal management apparatus attachment mechanism
US7570490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Dec 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.