Earset assembly
US7570777B1 · kind B1 · utility
67Cited by
14References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2004 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Jan 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R25/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wired or wireless earset assembly includes an earset housing having a curved portion configured to fit to the top of an ear, a speaker driver contained in a speaker housing, a flexible tube having a first extension so as to be coupled with at least a part of the curved portion of the earset housing and a second extension coupled with the speaker housing, a rotatable cap containing a bud coupled with the speaker driver, a sound delivery port in the bud, a circuitry for processing an input signal in the case, and a wire in the flexible tube connecting the circuitry and the speaker driver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.