Patent · US Active

Embossing systems and methods

US7571861B2 · kind B2 · utility

1Cited by
3References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 27, 2006
Grant dateAug 11, 2009
Priority date
Expiry dateJun 27, 2026

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB41J3/50
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

Systems and methods of embossing flat pieces (such as thin cards and similar materials) that prevent the embossed pieces from sticking to each other during subsequent handling. In some embodiments, pieces are manufactured in rows and columns on a large sheet, with (typically) the distance between text embossed on adjacent rows and (particularly) the distance between texts embossed on cards from adjacent columns being constant. Cards that will be stacked immediately adjacent each other after the cards are cut from the large sheet have text embossed on them that varies, so that the cards cannot tightly nest against each other and stick together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.