Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
US7572172B2 · kind B2 · utility
15Cited by
12References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2007 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Jan 11, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.