Polishing apparatus and pad replacing method thereof
US7572173B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2007 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Aug 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T483/174
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping a first area of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping a second area of the first polishing pad, the first area and the second area are opposite to each other. When the first polishing pad will be disconnected from the bottom surface of the polishing head and replaced by a second polishing pad, the first clamping element and the second clamping element are released from the first polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.