Dielectric paste for spacer layer of a multi-layered ceramic electronic component
US7572477B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2004 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Dec 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to provide a dielectric paste for a spacer layer of a multi-layered ceramic electronic component which 5 does not dissolve a binder contained in a layer adjacent to the spacer layer of the multi-layered ceramic electronic component and can reliably prevent defects from being generated in a multi-layered ceramic electronic component. A dielectric paste for forming a spacer layer according to the 10 present invention contains a butyral system resin as a binder and at least one solvent selected from the group consisting of dihydroterpinyl oxyethanol, terpinyl oxyethanol, d-dihydrocarveol, I-citronellol, I-perillylalcohol and acetoxy-methoxyethoxy-cyclohexanol acetate as a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.