Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
US7572515B2 · kind B2 · utility
7Cited by
32References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2005 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Jan 10, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.