Inkjet-fabricated integrated circuits
US7572651B2 · kind B2 · utility
8Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2004 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Dec 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/10
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming an integrated circuit including at least two interconnected electronic switching devices, the method comprising forming at least part of the electronic switching devices by ink-jet printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.