Semiconductor dynamic sensor and method of manufacturing the same
US7572659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Apr 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second layer. An elasticity modulus of the first layer is lower than that of the second layer, and the second layer has a water absorption smaller than that of the first layer. One surface of a semiconductor wafer is in contact with the first layer. Once the semiconductor wafer and the adhesive film are diced into a plurality of sensor chips, the sensor chip with the adhesive film is mounted on a sensor package via the second layer interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.