Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate
US7573359B2 · kind B2 · utility
2Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2007 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Jul 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against said insulating layer, less crosstalk may result from the formation of a microstrip on the bottom surface of the printed circuit board. The backing plate may also be used to secure a cooling device, such as a heat sink, on the opposite side of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.