High velocity air cooling for electronic equipment
US7573713B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 16, 2006 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Aug 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct. The flow device is configured to produce a pressure differential between an interior and an exterior of the container to cause high velocity air to flow through the container such that the electronic module can be operated in the selected mode at a second ambient temperature greater than the maximum first manufacturer's suggested ambient temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.