Model predictive thermal management
US7574321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2006 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Nov 6, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/425
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Electrical components which substantially dissipate the power provided them in the form of heat will change temperature in response to self heating, heat transfer to their surroundings, and heat transferred from one component to another. A method is disclosed for calculating the temperature of a component(s) using a thermal model. In one embodiment the power dissipation of each component is controlled to limit the temperature of the component. In one embodiment the temperature of a component is modified by changing the power dissipation of another component. In some embodiments the power dissipation of a component is modified by modifying its performance. In another embodiment power dissipation is modified by selecting one or more programs for modified execution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.