Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure
US7574787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Mar 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4981
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.