Method of manufacturing an implantable wireless sensor
US7574792B2 · kind B2 · utility
49Cited by
107References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Sep 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
In the disclosed method of manufacturing an implantable wireless sensor, a cavity is etched in one side of a first substrate. A conductive structure are formed on the base of the cavity. A second conductive structureare formed on a surface of a second substrate, and the two substrates are mutually imposed such that the two conductive plates and coils are disposed in opposed, spaced-apart relation. A laser is then used to cut away perimeter portions of the imposed substrates and simultaneously to heat bond the two substrates together such that the cavity in the first substrate is hermetically sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.