Patent · US Active

Pressure sensor mounting using a molded seal

US7574921B2 · kind B2 · utility

4Cited by

6References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Thomas Fessele · Nagold, DE
Jan Gebauer · Karlsruhe, DE
Marcell Ott · Nersingen, DE

Key dates

Filing date	Feb 5, 2007
Grant date	Aug 18, 2009
Priority date	—
Expiry date	Feb 5, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG01L19/0007
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A pressure sensor including a molded seal. With the aid of the molded seal the pressure sensor is held in place in an installation hole and seals the latter. The molded seal is attached to a sensor stem in a form locked manner. The molded seal is made of an elastic material and has, on its end facing away from the sensor head, a protrusion whose diameter exceeds the diameter of the installation hole. At least one annular recess is provided on the circumference of the sensor stem.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.