Heat dissipating device
US7575045B2 · kind B2 · utility
4Cited by
17References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 29, 2005 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.