Patent · US Active

Selective rework apparatus for surface mount components

US7575146B2 · kind B2 · utility

1Cited by

4References

9Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian D. Chapman · Gurnee, US
Mary Ann Emmett · Poughkeepsie, US
Arden S. Lake · Poughkeepsie, US
Wai Mon Wa · Poughkeepsie, US
Nandu N. Ranadive · Wappingers Falls, US
Michael Variano · Huntersville, US
John P. Weir · Lagrangeville, US

Key dates

Filing date	Nov 11, 2008
Grant date	Aug 18, 2009
Priority date	—
Expiry date	Nov 11, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/176
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.