Patent · US Active

Compliant wirebond pedestal

US7575147B2 · kind B2 · utility

1Cited by

14References

4Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Jeffrey W. Marsh · Sachse, US
R. Tracy White · Plano, US
David Hamilton · Belleville, US

Key dates

Filing date	May 8, 2007
Grant date	Aug 18, 2009
Priority date	—
Expiry date	Sep 12, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53174
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.